Brief: Discover the KDL-522 Two Way Reciprocating Fluid Polishing Machine, a bidirectional rheological precision polishing machine designed for high-precision surface treatment. Achieve nano-level finishes (Ra≤0.05μm) with adjustable reciprocating frequency and fluid pressure, ideal for semiconductors, additive manufacturing, and new energy applications.
Related Product Features:
Achieves nano-level surface finish (Ra≤0.05μm) with bidirectional abrasive fluid flow.
Equipped with an intelligent control system for adjustable reciprocating frequency (10-200Hz) and fluid pressure (0.1-20MPa).
Features AI adaptive control with real-time parameter adjustments via force feedback sensors.
Modular design allows quick fixture changes for different workpiece batches.
Increases polishing pass rate from 80% to 99.5% while reducing energy consumption by 30%.
Suitable for various materials, from aluminum alloy to silicon carbide.
Multi-station collaboration with double workbenches increases equipment utilization by 40%.
Ideal for emerging applications like semiconductor wafer carriers and 3D printed metal parts.
Faqs:
What is the maximum surface finish achievable with the KDL-522 polishing machine?
The KDL-522 can achieve a nano-level surface finish with Ra≤0.05μm, and with nano-abrasives, surfaces as fine as Ra<10nm are possible.
How does the AI adaptive control system enhance the polishing process?
The AI adaptive control system adjusts polishing parameters in real time using force feedback sensors, ensuring precise pressure control (±0.01MPa accuracy) and optimizing polishing paths through digital twin simulation.
What industries benefit most from the KDL-522 polishing machine?
The KDL-522 is ideal for semiconductors (stress-free polishing of wafer carriers), additive manufacturing (surface densification of 3D printed metal parts), and new energy (refined processing of fuel cell bipolar plate flow channels).